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Allfavor Circuits Technical Specification

Seq

Item

Technical Specification

Remarks

Standard

Advanced

1

Number of Layer

1-10 Layers

12-16 Layers

 

2

Base Material

FR4(High TG), Teflon, Rogers, Aluminum Based

 

3

Finish Board Thickness

0.30 mm ~ 3.20 mm
(8 mil ~ 126 mil)

0.20 mm ~ 4.5 mm
(5 mil ~ 177 mil)

 

4

Minimum Core Thickness

0.15mm(6 mil)

0.10mm ( 4 mil)

 

5

Copper Thickness

Min. 1/2 OZ, Max. 4 OZ

Min. 1/3 OZ, Max. 6 OZ

Selective Area
Available,
Thicker Cu On
Request

6

Min.Trace
Wide&Line 
Space

Single Sided

0.13 mm ( 5 mil )

0.10mm ( 4 mil)

 

Double Sided

0.13 mm ( 5 mil )

0.10mm ( 4 mil)

 

7

Min. Hole
Diameter

Drilling /PTH

φ0.20 mm ( 8 mil )

φ0.20 mm ( 8 mil )

 

Punching

φ1.0 mm ( 40 mil )

φ0.90 mm ( 36 mil )

If Necessary

8

Dimension
Tolerance

Hole Position

0.08 ( 3 mil )

 

Conductor Width(W)

20% Deviation of Master
 A/W

1mil Deviation of Master
A/W

 

Hole Diameter(H)

NPTH:+/-0.05 mm ( 2 mil )

NPTH:+/-0.05 mm ( 2 mil )

 

PTH: +/-0.075 mm ( 3 mil )

PTH: +/-0.05 mm ( 2 mil )

 

Outline Dimension

0.13 mm ( 5 mil )

0.10 mm ( 4 mil )

 

Conductors & Outline
( C - O )

0.15 mm ( 6 mil )

0.13 mm ( 5 mil )

 

Warp and Twist

0.75%

0.50%

 

9

Surface Treatment On Land Area

Leadfree HASL, Entek, Immersion Silver, Immersion 
Tin, Golden Finger, OSP

 

10

V-Cutting

Panel Size

457.2mm X 622 mm      
( max. )

457.2mm X 800 mm
( max. )

 

Board Thickness

0.50 mm (20mil) min.

0.30 mm (12mil) min.

 

Remain Thickness

1/3 board thickness

0.40 +/-0.10mm
( 16+/-4 mil )

 

Tolerance

±0.13 mm(5mil)

±0.1 mm(4mil)

 

Groove Width

0.50 mm (20mil) max.

0.38 mm (15mil) max.

 

Groove to Groove

20 mm (787mil) min.

10 mm (394mil) min.

 

Groove to Trace

0.45 mm(18mil) min.

0.38 mm(15mil) min.

 

11

Slot

Slot size tol.L≥2W

PTH Slot: L:+/-0.13(5mil) W:+/-0.08(3mil)

PTH Slot: L:+/-0.10(4mil) W:+/-0.05(2mil)

(1)L=Length of slot (2)W=Width of slot (3)Min.drill bit size     for multi-hit is
0.60mm

NPTH slot(mm) L+/-0.10
(4mil) W:+/-0.05(2mil)

NPTH slot(mm) L:+/-0.08
(3mil) W:+/-0.05(2mil)

12

Min Spacing
from hole
edge to
hole edge

0.30-1.60
(Hole Diameter)

0.15mm(6mil)

0.10mm(4mil)

 

1.61-6.50
(Hole Diameter)

0.15mm(6mil)

0.13mm(5mil)

 

13

Minimum spacing between hole edge
to circuitry pattern

PTH hole: 0.20mm(8mil)

PTH hole: 0.13mm(5mil)

 

NPTH hole: 0.18mm(7mil)

NPTH hole: 0.10mm(4mil)

 

14

Image transfer
Registration tol

Circuit pattern vs.
index hole

0.10(4mil)

0.08(3mil)

 

Circuit patten vs.2nd
drill hole

0.15(6mil)

0.10(4mil)

 

15

Registration tolerance of front/back
image

0.075mm(3mil)

0.05mm(2mil)

 

16

Multilayers

Layer-layer
misregistration

4layers:

0.15mm(6mil)
max.

4layers:

0.10mm(4mil)
max.

 

6layers:

0.20mm(8mil)
max.

6layers:

0.13mm(5mil)
max.

 

8layers:

0.25mm(10mil)
max.

8layers:

0.15mm(6mil)
max.

 

Min.Spacing From
Hole Edge
 to Innerlayer Pattern

0.225mm(9mil)

0.15mm(6mil)

 

Min.Spacing From Outline to
Innerlayer Pattern

0.38mm(15mil)

0.225mm(9mil)

 

Min. board thickness

4layers:0.30mm(12mil)

4layers:0.20mm(8mil)

 

6layers:0.60mm(24mil)

6layers:0.50mm(20mil)

 

8layers:1.0mm(40mil)

8layers:0.75mm(30mil)

 

Board thickness
tolerance

4layers:+/-0.13mm(5mil)

4layers:+/-0.10mm(4mil)

 

6layers:+/-0.15mm(6mil)

6layers:+/-0.13mm(5mil)

 

8-12 layers:+/-0.20mm
(8mil)

8-12 layers:+/-0.15mm
(6mil)

 

17

Insulation Resistance

10KΩ~20MΩ(typical:5MΩ)

 

18

Conductivity

<50Ω(typical:25Ω)

 

19

Test voltage

250V

 

20

Impedance control

Typical: 50Ω+/-10%

 

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